Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183703 | Leadframes in semiconductor devices | — | 2024-12-31 |
| 12177988 | Wafer level bump stack for chip scale package | — | 2024-12-24 |
| 12074098 | Three-dimensional functional integration | — | 2024-08-27 |
| 12066459 | Integrated circuit package with current sense element | Robert Allan Neidorff | 2024-08-20 |
| 12062597 | Three dimensional package for semiconductor devices and external components | Christopher Daniel Manack | 2024-08-13 |
| 12040249 | Packages with separate communication and heat dissipation paths | — | 2024-07-16 |
| 11978699 | Electronic device multilevel package substrate for improved electromigration preformance | Sylvester Ankamah-Kusi, Yiqi Tang, Rajen Manicon Murugan | 2024-05-07 |
| 11972994 | Film covers for sensor packages | Leslie Edward Stark, Steven Kummerl, Wai Lee | 2024-04-30 |
| 11908776 | Semiconductor device with metal die attach to substrate with multi-size cavity | Benjamin Stassen Cook, Nazila Dadvand | 2024-02-20 |
| 11894339 | Proximity sensor | Leslie Edward Stark | 2024-02-06 |
| 11887906 | Packaged device with die wrapped by a substrate | — | 2024-01-30 |
| 11869820 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Siva Prakash Gurrum, Christopher Daniel Manack | 2024-01-09 |
| 11869864 | Nanowires plated on nanoparticles | Benjamin Stassen Cook, Ralf Jakobskrueger Muenster | 2024-01-09 |