Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159808 | Wire bond damage detector including a detection bond pad over a first and a second connected structures | Hung-Yun Lin | 2024-12-03 |
| 11869820 | IC having a metal ring thereon for stress reduction | Amit Sureshkumar Nangia, Sreenivasan K. Koduri, Christopher Daniel Manack | 2024-01-09 |