Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176298 | Floating die package | Benjamin Stassen Cook, Kurt Peter Wachtler | 2024-12-24 |
| 12087859 | Method for improving transistor performance | Matthew John Sherbin, Saumya Gandhi | 2024-09-10 |
| 12080633 | Custom leadframe from standard plus printed leadframe portion | Jo Bito, Benjamin Stassen Cook | 2024-09-03 |
| 12040197 | Mechanical couplings designed to resolve process constraints | Yuh-Harng Chien, Hung-Yu Chou, Fu-Kang Lee | 2024-07-16 |
| 11972994 | Film covers for sensor packages | Sreenivasan K. Koduri, Leslie Edward Stark, Wai Lee | 2024-04-30 |