Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040197 | Mechanical couplings designed to resolve process constraints | Yuh-Harng Chien, Fu-Kang Lee, Steven Kummerl | 2024-07-16 |
| 11973052 | Stud bump for wirebonding high voltage isolation barrier connection | Chien-Chang Li, Sheng-Wen Huang, Zi-Xian Zhan, Byron Lovell Williams | 2024-04-30 |
| 11948721 | Packaged isolation barrier with integrated magnetics | Ying-Chuan Kao, Dong-Ren Peng, Jun Jie Kuo, Kenji Otake, Chih-Chien Ho | 2024-04-02 |
| 11942448 | Integrated circuit die pad cavity | Bo-Hsun Pan, Chung-Hao Lin, Yuh-Harng Chien | 2024-03-26 |
| 11862538 | Semiconductor die mounted in a recess of die pad | Chung-Hao Lin, Bo-Hsun Pan, Dong-Ren Peng, Pi-Chiang Huang, Yuh-Harng Chien | 2024-01-02 |