Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973052 | Stud bump for wirebonding high voltage isolation barrier connection | Hung-Yu Chou, Sheng-Wen Huang, Zi-Xian Zhan, Byron Lovell Williams | 2024-04-30 |
| 11902063 | PDCCH DMRS mapping and coreset resource allocation | Yiju Liao, Chien-Hwa Hwang | 2024-02-13 |
| 11895510 | Physical downlink control channel design for NR systems | Chien-Hwa Hwang, Yi-Ju Liao, Pei-Kai Liao, Weidong Yang | 2024-02-06 |