Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973052 | Stud bump for wirebonding high voltage isolation barrier connection | Chien-Chang Li, Hung-Yu Chou, Sheng-Wen Huang, Byron Lovell Williams | 2024-04-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973052 | Stud bump for wirebonding high voltage isolation barrier connection | Chien-Chang Li, Hung-Yu Chou, Sheng-Wen Huang, Byron Lovell Williams | 2024-04-30 |