Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948721 | Packaged isolation barrier with integrated magnetics | Ying-Chuan Kao, Hung-Yu Chou, Jun Jie Kuo, Kenji Otake, Chih-Chien Ho | 2024-04-02 |
| 11862538 | Semiconductor die mounted in a recess of die pad | Chung-Hao Lin, Hung-Yu Chou, Bo-Hsun Pan, Pi-Chiang Huang, Yuh-Harng Chien | 2024-01-02 |