Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942448 | Integrated circuit die pad cavity | Hung-Yu Chou, Chung-Hao Lin, Yuh-Harng Chien | 2024-03-26 |
| 11862538 | Semiconductor die mounted in a recess of die pad | Chung-Hao Lin, Hung-Yu Chou, Dong-Ren Peng, Pi-Chiang Huang, Yuh-Harng Chien | 2024-01-02 |