Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040197 | Mechanical couplings designed to resolve process constraints | Hung-Yu Chou, Fu-Kang Lee, Steven Kummerl | 2024-07-16 |
| 11942448 | Integrated circuit die pad cavity | Bo-Hsun Pan, Hung-Yu Chou, Chung-Hao Lin | 2024-03-26 |
| 11862538 | Semiconductor die mounted in a recess of die pad | Chung-Hao Lin, Hung-Yu Chou, Bo-Hsun Pan, Dong-Ren Peng, Pi-Chiang Huang | 2024-01-02 |