Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978699 | Electronic device multilevel package substrate for improved electromigration preformance | Yiqi Tang, Rajen Manicon Murugan, Sreenivasan K. Koduri | 2024-05-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978699 | Electronic device multilevel package substrate for improved electromigration preformance | Yiqi Tang, Rajen Manicon Murugan, Sreenivasan K. Koduri | 2024-05-07 |