Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107062 | Semiconductor device with solder on pillar | — | 2024-10-01 |
| 12100678 | Conductive members for die attach in flip chip packages | Christopher Daniel Manack, Salvatore Frank Pavone, Maricel Fabia Escaño | 2024-09-24 |
| 12080667 | Conductive terminal for side facing packages | Jose Arvin Matute Plomantes | 2024-09-03 |
| 12009272 | Integral redistribution layer for WCSP | — | 2024-06-11 |
| 11929308 | Flip chip package assembly | Steffany Ann Lacierda Moreno, John Carlo Cruz Molina | 2024-03-12 |
| 11876065 | Flip chip package assembly | Katleen Fajardo Timbol, Salvatore Frank Pavone | 2024-01-16 |
| 11862576 | IC having electrically isolated warpage prevention structures | Christlyn Faith Hobrero Arias | 2024-01-02 |
| 11864471 | Semiconductor device with passivated magnetic concentrator | Dok Won Lee, Kashyap Mohan | 2024-01-02 |