Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132027 | Semiconductor device assembly with pre-reflowed solder | James Raymond Maliclic Baello, Jose Carlos Arroyo | 2024-10-29 |
| 11929308 | Flip chip package assembly | John Carlo Cruz Molina, Rafael Jose Lizares Guevara | 2024-03-12 |