Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942387 | Plated walls defining mold compound cavities | Julian Carlo Barbadillo, Ray Fredric De Asis | 2024-03-26 |
| 11929308 | Flip chip package assembly | Steffany Ann Lacierda Moreno, Rafael Jose Lizares Guevara | 2024-03-12 |
| 11862479 | MCM package isolation through leadframe design and package saw process | Bernard Kaebin Andres Ancheta, Emerson Mamaril Enipin | 2024-01-02 |