Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100678 | Conductive members for die attach in flip chip packages | Christopher Daniel Manack, Salvatore Frank Pavone, Rafael Jose Lizares Guevara | 2024-09-24 |
| 12027483 | Packaged semiconductor device with electroplated pillars | Arvin Cedric Quiambao Mallari, Armando Tresvalles Clarina, Jr., Jovenic Romero Esquejo | 2024-07-02 |
| 11942407 | Semiconductor chip packages having bond over active circuit (BOAC) structures | Jeffrey Salvacion Solas | 2024-03-26 |