Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087673 | QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same | Abram Castro, Usman Mahmood Chaudhry, Joe Adam Garcia | 2024-09-10 |
| 12074134 | Package for stress sensitive component and semiconductor device | Anindya Poddar, Hau Nguyen, Masamitsu Matsuura, Ting-Ta Yen | 2024-08-27 |
| 12009336 | Packages with electrical fuses | Amin Ahmad Sijelmassi, Murali Kittappa, Anindya Poddar, Honglin Guo, Joe Adam Garcia +1 more | 2024-06-11 |
| 11948871 | Process for thin film capacitor integration | Benjamin Stassen Cook, Yogesh Kumar Ramadass, Salvatore Frank Pavone | 2024-04-02 |