Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +2 more | 2024-11-26 |
| 12125799 | Embedded die packaging with integrated ceramic substrate | Woochan Kim, Kengo Aoya, Vivek Kishorechand Arora, Anindya Poddar | 2024-10-22 |
| 12114568 | Method for manufacturing thermoelectric conversion module | Yuta Seki, Kunihisa Kato, Wataru MORITA | 2024-10-08 |
| 11923320 | Semiconductor device having tapered metal coated sidewalls | Tomoko Noguchi, Kengo Aoya, Masamitsu Matsuura | 2024-03-05 |