Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119263 | Methods and apparatus for an improved integrated circuit package | — | 2024-10-15 |
| 12046542 | Heat-dissipating wirebonded members on package surfaces | Makoto Yoshino, Kengo Aoya | 2024-07-23 |
| 12040260 | Electronic package with surface contact wire extensions | Ayumu Kuroda, Kengo Aoya | 2024-07-16 |
| 11955456 | Flip chip packaged devices with thermal pad | Anindya Poddar, Ashok S. Prabhu, Hau Nguyen, Kurt Sincerbox | 2024-04-09 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Masamitsu Matsuura, Kengo Aoya, Hideaki Matsunaga, Anindya Poddar | 2024-03-26 |
| 11933533 | Blower and refrigerator | Tomohiko Matsuno, Tomoharu Iwamoto, Tatsuya Seo, Hitoshi Takase | 2024-03-19 |