Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154861 | Frame design in embedded die package | Woochan Kim, Masamitsu Matasuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +2 more | 2024-11-26 |
| 11942384 | Semiconductor package having an interdigitated mold arrangement | Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya, Anindya Poddar | 2024-03-26 |