Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756856 | Package architecture including thermoelectric cooler structures | Krishna Vasanth Valavala, Ravindranath V. Mahajan, Chandra Mohan Jha, Kelly Lofgreen | 2023-09-12 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2023-09-12 |
| 11676883 | Thermoelectric coolers combined with phase-change material in integrated circuit packages | Javed Shaikh, Je-Young Chang, Kelly Lofgreen, Aastha Uppal | 2023-06-13 |
| 11664294 | Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies | Aastha Uppal, Je-Young Chang, Minseok Ha | 2023-05-30 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Chandra Mohan Jha, Zhimin Wan | 2023-04-11 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Nitin A. Deshpande +6 more | 2023-02-07 |