Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11833637 | Control of steam generation for chemical mechanical polishing | Hari Soundararajan, Calvin Spencer Lee, Jonathan P. Domin, Shuchivrat Datar, Dmitry Sklyar +3 more | 2023-12-05 |
| 11826872 | Temperature and slurry flow rate control in CMP | Haosheng Wu, Jianshe Tang, Brian J. Brown, Shih-Haur Shen, Hari Soundararajan | 2023-11-28 |
| 11819976 | Spray system for slurry reduction during chemical mechanical polishing (cmp) | Chih Chung Chou, Anand N. Iyer, Ekaterina A. Mikhaylichenko, Christopher Heung-Gyun Lee, Erik S. Rondum +1 more | 2023-11-21 |
| 11806835 | Slurry distribution device for chemical mechanical polishing | Yen-Chu Yang, Stephen Jew, Jianshe Tang, Haosheng Wu, Paul D. Butterfield +2 more | 2023-11-07 |
| 11780046 | Polishing system with annular platen or polishing pad | Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Steven M. Zuniga, Fred C. Redeker | 2023-10-10 |
| 11752589 | Chemical mechanical polishing temperature scanning apparatus for temperature control | Hari Soundararajan, Haosheng Wu, Jianshe Tang | 2023-09-12 |
| 11728185 | Steam-assisted single substrate cleaning process and apparatus | Jianshe Tang, Wei Lu, Haosheng Wu, Taketo Sekine, Hari Soundararajan +1 more | 2023-08-15 |
| 11697187 | Temperature-based assymetry correction during CMP and nozzle for media dispensing | Haosheng Wu, Jianshe Tang, Chih Chung, Hui Chen, Hari Soundararajan +1 more | 2023-07-11 |
| 11633833 | Use of steam for pre-heating of CMP components | Haosheng Wu, Jianshe Tang, Hari Soundararajan, Paul D. Butterfield, Hui Chen +2 more | 2023-04-25 |
| 11628478 | Steam cleaning of CMP components | Haosheng Wu, Jianshe Tang, Hari Soundararajan, Hui Chen, Chih Chung Chou +2 more | 2023-04-18 |
| 11597052 | Temperature control of chemical mechanical polishing | Hari Soundararajan, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj +1 more | 2023-03-07 |
| 11577358 | Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing | Surajit Kumar, Hui Chen, Chih Chung Chou | 2023-02-14 |