Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11819976 | Spray system for slurry reduction during chemical mechanical polishing (cmp) | Chih Chung Chou, Anand N. Iyer, Ekaterina A. Mikhaylichenko, Erik S. Rondum, Tiffany Yu-Nung Cheung +1 more | 2023-11-21 |
| 11794305 | Platen surface modification and high-performance pad conditioning to improve CMP performance | Anand N. Iyer, Hyuen Karen Tran, Ghunbong Cheung | 2023-10-24 |
| 11673226 | Retaining ring for CMP | Andrew J. Nagengast, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang +3 more | 2023-06-13 |