Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2023-12-26 |
| 11842944 | IC assemblies including die perimeter frames suitable for containing thermal interface materials | Frederick Atadana, Taylor Gaines, Minseok Ha | 2023-12-12 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11679407 | Liquid metal thermal interface material application | Joseph Petrini, Aaron McCann, Shankar Devasenathipathy, James C. Matayabas, Jr., Mostafa Aghazadeh +1 more | 2023-06-20 |
| 11622466 | Low force liquid metal interconnect solutions | Karumbu Meyyappan, David Craig, Pooya Tadayon | 2023-04-04 |
| 11616000 | Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material | Dong-Ho Han, Jaejin Lee, Jerrod Peterson | 2023-03-28 |