Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11679407 | Liquid metal thermal interface material application | Kyle Arrington, Joseph Petrini, Aaron McCann, Shankar Devasenathipathy, James C. Matayabas, Jr. +1 more | 2023-06-20 |
| 11616000 | Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material | Dong-Ho Han, Jaejin Lee, Kyle Arrington | 2023-03-28 |
| 11545410 | Enhanced systems and methods for improved heat transfer from semiconductor packages | Mark MacDonald, David Pidwerbecki, Mark Gallina | 2023-01-03 |