Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094544 | Methods of forming self-aligned vias | Benjamin Schmiege, Jeffrey W. Anthis, Abhijit Basu Mallick, Susmit Singha Roy, Ziqing Duan +3 more | 2021-08-17 |
| 11028477 | Bottom-up gap-fill by surface poisoning treatment | Mark Saly, Keiichi Tanaka, Eswaranand Venkatasubramanian, Mandyam Sriram, Bhaskar Jyoti Bhuyan +2 more | 2021-06-08 |
| 11028478 | Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors | Victor Nguyen, Ning Li, Mihaela Balseanu, Li-Qun Xia, Mark Saly | 2021-06-08 |
| 11028480 | Methods of protecting metallic components against corrosion using chromium-containing thin films | Thomas Knisley, Mark Saly, David Alexander BRITZ | 2021-06-08 |
| 10985009 | Methods to deposit flowable (gap-fill) carbon containing films using various plasma sources | Lakmal C. Kalutarage, Mark Saly, William J. Durand, Kelvin Chan, Hanhong Chen +1 more | 2021-04-20 |
| 10906925 | Ruthenium precursors for ALD and CVD thin film deposition and uses thereof | Benjamin Schmiege, Jeffrey W. Anthis | 2021-02-02 |