Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164753 | Self-aligned double patterning with spatial atomic layer deposition | Ning Li, Victor Nguyen, Li-Qun Xia, Keiichi Tanaka, Steven Marcus | 2021-11-02 |
| 11158489 | Methods and systems to modulate film stress | Tsutomu Tanaka, John C. Forster, Ran Liu, Kenichi Ohno, Ning Li +2 more | 2021-10-26 |
| 11133178 | Seamless gapfill with dielectric ALD films | Ning Li | 2021-09-28 |
| 11028478 | Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors | Victor Nguyen, Ning Li, Li-Qun Xia, Mark Saly, David Thompson | 2021-06-08 |
| 11017997 | Methods and apparatus for low temperature silicon nitride films | Wenbo Yan, Cong Trinh, Ning Li, Li-Qun Xia, Maribel Maldonado-Garcia | 2021-05-25 |
| 10957532 | Method and apparatus for deposition of low-k films | Ning Li, Zhelin Sun, Li-Qun Xia, Bhaskar Jyoti Bhuyan, Mark Saly | 2021-03-23 |
| 10923396 | Method of forming self-aligned via | Suketu Arun Parikh | 2021-02-16 |