| 11177234 |
Package architecture with improved via drill process and method for forming such package |
Suddhasattwa Nad, Marcel Wall |
2021-11-16 |
| 11177232 |
Circuit device with monolayer bonding between surface structures |
Suddhasattwa Nad, Marcel Wall |
2021-11-16 |
| 11164818 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman |
2021-11-02 |
| 11158558 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2021-10-26 |
| 11107781 |
RFIC having coaxial interconnect and molded layer |
Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing |
2021-08-31 |
| 11081448 |
Embedded die microelectronic device with molded component |
Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne |
2021-08-03 |
| 11062933 |
Die placement and coupling apparatus |
Jesse C. Jones, Gang Duan, Yosuke Kanaoka |
2021-07-13 |
| 10892219 |
Molded embedded bridge for enhanced EMIB applications |
Srinivas V. Pietambaram |
2021-01-12 |