Issued Patents 2019
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522451 | Fan-out semiconductor package | Da Hee Kim, Sung Won Jeong | 2019-12-31 |
| 10522497 | Fan-out semiconductor package | Jeong Ho Lee, Bong Ju Cho, Jin Su Kim, Shang Hoon Seo, Jeong Il LEE | 2019-12-31 |
| 10475776 | Fan-out semiconductor package module | Yeong A Kim, Eun Sil Kim, Akihisa Kuroyanagi, Jin Su Kim, Jun Woo Myung | 2019-11-12 |
| 10475748 | Fan-out semiconductor package | Jeong Ho Lee, Myung Sam Kang, Shang Hoon Seo, Jin Su Kim | 2019-11-12 |
| 10455708 | Multilayered substrate and method for manufacturing the same | Seok Hwan AHN, Mi Sun Hwang, Jong Seok Bae, Myung Sam Kang | 2019-10-22 |
| 10446478 | Semiconductor package | Kwang Ok Jeong, Dong Won Kang, Ik Jun Choi, Jung Soo Byun | 2019-10-15 |
| 10438884 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Tae Sung Jeong, Ik Jun Choi, Jung Soo Byun | 2019-10-08 |
| 10410961 | Fan-out semiconductor package | Jeong Ho Lee, Myung Sam Kang, Jin Su Kim, Shang Hoon Seo, Jeong Il LEE | 2019-09-10 |
| 10403579 | Semiconductor device and method for manufacturing the same | Han Ul Lee, Jin Su Kim | 2019-09-03 |
| 10388614 | Fan-out semiconductor package and method of manufacturing same | Ji Hyun Lee, Kyoung Moo Harr, Seung Yeop Kook, Ji Hoon Kim | 2019-08-20 |
| 10373884 | Fan-out semiconductor package for packaging semiconductor chip and capacitors | Han KIM, Mi-Ja Han, Kang Heon Hur | 2019-08-06 |
| 10362667 | Circuit board and manufacturing method thereof | Tae Hong Min, Myung Sam Kang, Jung Han Lee | 2019-07-23 |
| 10347556 | Passivation layer having opening for under bump metallurgy | Han Ul Lee, Jin Su Kim | 2019-07-09 |
| 10306778 | Printed circuit board with dam around cavity and manufacturing method thereof | Jae Ean LEE, Jee-Soo Mok, Soon-Oh Jung, Kyung Hwan Ko, Yong Ho Baek | 2019-05-28 |
| 10262949 | Fan-out semiconductor package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Jung Ho Shim | 2019-04-16 |
| 10256200 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Jung Ho Shim | 2019-04-09 |
| 10212803 | Circuit board and circuit board assembly | Tae Hong Min, Myung Sam Kang, Jung Han Lee | 2019-02-19 |
| 10211136 | Fan-out semiconductor package | Da Hee Kim, Sung Won Jeong | 2019-02-19 |
| 10199337 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Jung Ho Shim | 2019-02-05 |
| 10170386 | Electronic component package and method of manufacturing the same | Seung On KANG, Woo-Sung Han, Chul Kyu KIM, Han Kim | 2019-01-01 |