Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522497 | Fan-out semiconductor package | Jeong Ho Lee, Bong Ju Cho, Young Gwan Ko, Jin Su Kim, Jeong Il LEE | 2019-12-31 |
| 10475748 | Fan-out semiconductor package | Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Jin Su Kim | 2019-11-12 |
| 10461008 | Electronic component package having stress alleviation structure | Sung Won Jeong, Ji Hoon Kim, Sun Ho Kim, Seung Yeop Kook, Christian Romero | 2019-10-29 |
| 10446481 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Seung Yeop Kook, Sung Won Jeong | 2019-10-15 |
| 10410961 | Fan-out semiconductor package | Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Jin Su Kim, Jeong Il LEE | 2019-09-10 |
| 10347586 | Fan-out semiconductor package | Jin Su Kim, Jeong Ho Lee, Bong Ju Cho | 2019-07-09 |