Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10477683 | Printed circuit board including sub-circuit board | Yong Ho Baek, Jung-Hyun Cho | 2019-11-12 |
| 10461008 | Electronic component package having stress alleviation structure | Sung Won Jeong, Ji Hoon Kim, Sun Ho Kim, Shang Hoon Seo, Christian Romero | 2019-10-29 |
| 10446481 | Fan-out semiconductor package and electronic device including the same | Sun Ho Kim, Ji Hoon Kim, Ha Young Ahn, Shang Hoon Seo, Sung Won Jeong | 2019-10-15 |
| 10388614 | Fan-out semiconductor package and method of manufacturing same | Ji Hyun Lee, Kyoung Moo Harr, Ji Hoon Kim, Young Gwan Ko | 2019-08-20 |
| 10270948 | Substrate for camera module and camera module having the same | Seung Eun Lee, Jin Seon Park, Yul Kyo Chung, Chul CHOI, Dae Young Jung | 2019-04-23 |