Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10511080 | Fan-out semiconductor package | Won Wook So, Doo Il Kim, Young Sik Hur | 2019-12-17 |
| 10477683 | Printed circuit board including sub-circuit board | Jung-Hyun Cho, Seung Yeop Kook | 2019-11-12 |
| 10475842 | Fan-out sensor package and camera module | Byoung Chan Kim | 2019-11-12 |
| 10475756 | Composite antenna substrate and semiconductor package module | Doo Il Kim, Young Sik Hur, Jung-Hyun Cho, Won Wook So | 2019-11-12 |
| 10474868 | Fan-out semiconductor package | Jung-Hyun Cho, Byoung Chan Kim | 2019-11-12 |
| 10403562 | Fan-out semiconductor package module | Joo Hwan Jung, Yoo Rim Cha, Young Sik Hur, Jung Chul Gong | 2019-09-03 |
| 10395088 | Fan-out fingerprint sensor package | Min Keun KIM, Young Sik Hur, Tae Hee Han | 2019-08-27 |
| 10347598 | Composite antenna substrate and semiconductor package module | Doo Il Kim, Young Sik Hur, Jung-Hyun Cho, Won Wook So | 2019-07-09 |
| 10347613 | Fan-out semiconductor package | Byoung Chan Kim, Moon Il Kim, Young Sik Hur, Tae Hee Han | 2019-07-09 |
| 10332843 | Fan-out semiconductor package | Moon Hee Yi, Kyung Sang LIM | 2019-06-25 |
| 10325856 | Electronic component package and method of manufacturing the same | Sang Kun Kim, Ye-Jeong Kim, Jae Ean LEE, Jae Hoon Choi | 2019-06-18 |
| 10306778 | Printed circuit board with dam around cavity and manufacturing method thereof | Jae Ean LEE, Jee-Soo Mok, Young Gwan Ko, Soon-Oh Jung, Kyung Hwan Ko | 2019-05-28 |
| 10297553 | Electronic component package and method of manufacturing the same | Sang Kun Kim, Ye-Jeong Kim, Jae Ean LEE, Jae Hoon Choi | 2019-05-21 |
| 10283439 | Fan-out semiconductor package including electromagnetic interference shielding layer | Jung-Hyun Cho, Jun Oh Hwang, Joo Hwan Jung, Moon Hee Yi | 2019-05-07 |
| 10256192 | Fan-out semiconductor package | Moon Hee Yi, Byoung Chan Kim, Jung-Hyun Cho | 2019-04-09 |
| 10242973 | Fan-out-semiconductor package module | Joo Hwan Jung, Young Sik Hur, Jung Chul Gong, Han Kim | 2019-03-26 |
| 10177103 | Fan-out semiconductor package | Moon Hee Yi, Tae-Seong Kim | 2019-01-08 |