Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438884 | Carrier substrate and method of manufacturing semiconductor package using the same | Tae Sung Jeong, Young Gwan Ko, Ik Jun Choi, Jung Soo Byun | 2019-10-08 |
| 10325856 | Electronic component package and method of manufacturing the same | Yong Ho Baek, Sang Kun Kim, Ye-Jeong Kim, Jae Hoon Choi | 2019-06-18 |
| 10306778 | Printed circuit board with dam around cavity and manufacturing method thereof | Jee-Soo Mok, Young Gwan Ko, Soon-Oh Jung, Kyung Hwan Ko, Yong Ho Baek | 2019-05-28 |
| 10297553 | Electronic component package and method of manufacturing the same | Yong Ho Baek, Sang Kun Kim, Ye-Jeong Kim, Jae Hoon Choi | 2019-05-21 |