Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446478 | Semiconductor package | Kwang Ok Jeong, Dong Won Kang, Young Gwan Ko, Jung Soo Byun | 2019-10-15 |
| 10438884 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Tae Sung Jeong, Young Gwan Ko, Jung Soo Byun | 2019-10-08 |