Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10447411 | Acoustic wave device and method of manufacturing the same | Seung Wook Park, No Il Park | 2019-10-15 |
| 10438884 | Carrier substrate and method of manufacturing semiconductor package using the same | Jae Ean LEE, Young Gwan Ko, Ik Jun Choi, Jung Soo Byun | 2019-10-08 |
| 10431615 | Fan-out sensor package and camera module including the same | Ju Ho Kim | 2019-10-01 |
| 10340153 | Fan-out semiconductor package and method of manufacturing same | Hong Won Kim | 2019-07-02 |
| 10340234 | Substrate having embedded electronic component | Hong In KIM, Thomas A. Kim | 2019-07-02 |
| 10298199 | Acoustic wave device and method for manufacturing the same | Seung Wook Park, No Il Park | 2019-05-21 |