Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396432 | Antenna-integrated radio frequency module | Hong In KIM, Ho Kyung KANG | 2019-08-27 |
| 10340234 | Substrate having embedded electronic component | Hong In KIM, Tae Sung Jeong | 2019-07-02 |
| 10170410 | Semiconductor package with core substrate having a through hole | Tae Hyun Kim, Kyu Bum Han, Tae Hoon Kim | 2019-01-01 |