Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10190041 | Encapsulated porous proppant | John Fuertez, John McLennan, Taylor D. Sparks | 2019-01-29 |
| 10170410 | Semiconductor package with core substrate having a through hole | Tae Hyun Kim, Thomas A. Kim, Tae Hoon Kim | 2019-01-01 |