Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490349 | Coil component and method for manufacturing the same | Sang Jong Lee, Su Bong Jang, Min Ki Jung | 2019-11-26 |
| 10475751 | Fan-out semiconductor package | Seong Hee Choi, Hyung Joon Kim, Mi-Ja Han | 2019-11-12 |
| 10304784 | Fan-out semiconductor package | Jong-Man Kim, Kyung Ho Lee | 2019-05-28 |
| 10304807 | Fan-out semiconductor package | Dae-Hyun Park, Eun Jung Jo, Sung Won Jeong, Mi-Ja Han | 2019-05-28 |
| 10242973 | Fan-out-semiconductor package module | Yong Ho Baek, Joo Hwan Jung, Young Sik Hur, Jung Chul Gong | 2019-03-26 |
| 10217631 | Fan-out semiconductor package | Mi-Ja Han, Dae-Hyun Park, Sang Jong Lee, Seong Hee Choi | 2019-02-26 |
| 10199337 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Kang Heon Hur, Young Gwan Ko, Jung Ho Shim | 2019-02-05 |
| 10192831 | Fan-out semiconductor package module | Hyung Joon Kim | 2019-01-29 |
| 10170386 | Electronic component package and method of manufacturing the same | Seung On KANG, Woo-Sung Han, Young Gwan Ko, Chul Kyu KIM | 2019-01-01 |