Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325891 | Fan-out semiconductor package and package on package including the same | Jae Hyun Lim, Han Kim, Eun Jung Jo, Sang Jong Lee, Hyung Joon Kim | 2019-06-18 |
| 10262949 | Fan-out semiconductor package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko | 2019-04-16 |
| 10256200 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko | 2019-04-09 |
| 10199337 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko | 2019-02-05 |