Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403588 | Fan-out semiconductor package | Han KIM, Kyung Moon JUNG, Seok Hwan Kim, Kyung Ho Lee | 2019-09-03 |
| 10373884 | Fan-out semiconductor package for packaging semiconductor chip and capacitors | Han KIM, Mi-Ja Han, Young Gwan Ko | 2019-08-06 |
| 10262949 | Fan-out semiconductor package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Young Gwan Ko, Jung Ho Shim | 2019-04-16 |
| 10256200 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Young Gwan Ko, Jung Ho Shim | 2019-04-09 |
| 10199337 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Young Gwan Ko, Jung Ho Shim | 2019-02-05 |