Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504855 | Semiconductor package | Kyung Moon JUNG, Chul Kyu KIM, Kyung Ho Lee, Seong Hwan Park | 2019-12-10 |
| 10467450 | Fan-out sensor package | Ju Ho Kim, Eun Sil Kim, Sang Kyu Lee, Jong-Man Kim | 2019-11-05 |
| 10403588 | Fan-out semiconductor package | Han KIM, Kyung Moon JUNG, Kyung Ho Lee, Kang Heon Hur | 2019-09-03 |
| 10363708 | Composition for preparing lightweight transparent composite, method of preparing composite using the same and composite prepared thereby | Young Ho Choi, Sang Sun Park, Kyung Mo Yang | 2019-07-30 |
| 10351735 | Conductive adhesive and bonding method of composite material using the conductive adhesive | Young Ho Choi, Kie Youn Jeong | 2019-07-16 |