Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504836 | Fan-out semiconductor package | Akihisa Kuroyanagi, Jun Woo Myung, Yeong A Kim | 2019-12-10 |
| 10475776 | Fan-out semiconductor package module | Yeong A Kim, Young Gwan Ko, Akihisa Kuroyanagi, Jin Su Kim, Jun Woo Myung | 2019-11-12 |
| 10467450 | Fan-out sensor package | Ju Ho Kim, Sang Kyu Lee, Jong-Man Kim, Seok Hwan Kim | 2019-11-05 |
| 10276467 | Fan-out semiconductor package | Doo Hwan Lee, Dae Jung Byun, Tae Ho Ko, Yeong A Kim | 2019-04-30 |