Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522497 | Fan-out semiconductor package | Jeong Ho Lee, Bong Ju Cho, Young Gwan Ko, Shang Hoon Seo, Jeong Il LEE | 2019-12-31 |
| 10504825 | Fan-out semiconductor package | Jeong Il LEE, Jeong Ho Lee, Bong Ju Cho | 2019-12-10 |
| 10475776 | Fan-out semiconductor package module | Yeong A Kim, Eun Sil Kim, Young Gwan Ko, Akihisa Kuroyanagi, Jun Woo Myung | 2019-11-12 |
| 10475748 | Fan-out semiconductor package | Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Shang Hoon Seo | 2019-11-12 |
| 10457595 | Laser welded glass packages | Heather Debra Boek, Leonard Charles Dabich, II, David Alan Deneka, Shari Elizabeth Koval, Stephan Lvovich Logunov +2 more | 2019-10-29 |
| 10453788 | Fan-out semiconductor package | Jeong II LEE, Jeong Ho Lee, Bong Ju Cho | 2019-10-22 |
| 10437145 | Method of detaching a pellicle from a photomask | Jae-Hyuck Choi, Kyoung-Mi Kim, Byung-Gook Kim | 2019-10-08 |
| 10410961 | Fan-out semiconductor package | Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Shang Hoon Seo, Jeong Il LEE | 2019-09-10 |
| 10403579 | Semiconductor device and method for manufacturing the same | Han Ul Lee, Young Gwan Ko | 2019-09-03 |
| 10379283 | Lighting device having diffuser with array of 3D elements | Jae Hyuk Jang, Seung Jong Baek, Dong Hyun Lee | 2019-08-13 |
| 10347586 | Fan-out semiconductor package | Jeong Ho Lee, Shang Hoon Seo, Bong Ju Cho | 2019-07-09 |
| 10347556 | Passivation layer having opening for under bump metallurgy | Han Ul Lee, Young Gwan Ko | 2019-07-09 |
| 10345698 | Method for fabricating semiconductor device | Ji-Beom Yoo, Sung Won Kwon, Dong Wook Shin, Mun Ja Kim, Hwan Chul Jeon | 2019-07-09 |
| 10338297 | Lighting device using line shaped beam | Jae Hyuk Jang, Seung Jong Baek, Dong Hyun Lee | 2019-07-02 |
| 10317607 | Optical member having three-dimensional effect forming portion and multiple effect forming portion and lighting device using the same | Dong Hyun Lee, Seung Jong Baek, Jae Hyuk Jang | 2019-06-11 |
| 10312195 | Fan-out semiconductor package | Ji Hyun Lee, Jin Gu Kim, Chang Bae Lee | 2019-06-04 |
| 10253550 | Vacuum insulated glass units and methodology for manufacturing the same | Aize Li, Timothy James Orsley | 2019-04-09 |