Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504836 | Fan-out semiconductor package | Akihisa Kuroyanagi, Eun Sil Kim, Yeong A Kim | 2019-12-10 |
| 10475776 | Fan-out semiconductor package module | Yeong A Kim, Eun Sil Kim, Young Gwan Ko, Akihisa Kuroyanagi, Jin Su Kim | 2019-11-12 |