Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515755 | Coil electronic component and method of manufacturing the same | Ki Seok Kim, Ye-Jeong Kim, Kwang Hee KWON | 2019-12-24 |
| 10475748 | Fan-out semiconductor package | Jeong Ho Lee, Young Gwan Ko, Shang Hoon Seo, Jin Su Kim | 2019-11-12 |
| 10455708 | Multilayered substrate and method for manufacturing the same | Seok Hwan AHN, Mi Sun Hwang, Young Gwan Ko, Jong Seok Bae | 2019-10-22 |
| 10410961 | Fan-out semiconductor package | Jeong Ho Lee, Young Gwan Ko, Jin Su Kim, Shang Hoon Seo, Jeong Il LEE | 2019-09-10 |
| 10395814 | Coil electronic component and method of manufacturing the same | Ki Seok Kim, Ye-Jeong Kim, Kwang Hee KWON | 2019-08-27 |
| 10362667 | Circuit board and manufacturing method thereof | Tae Hong Min, Jung Han Lee, Young Gwan Ko | 2019-07-23 |
| 10356916 | Printed circuit board with inner layer and outer layers and method of manufacturing the same | Han Kim, Sang Yul Ha, Sung Han Kim, Kyung Ho Lee, Seok Hwan AHN | 2019-07-16 |
| 10304628 | Multilayer capacitor and manufacturing method thereof | Mi Sun Hwang, Dong Keun Lee | 2019-05-28 |
| 10217709 | Fan-out semiconductor package | Seon Ha Kang | 2019-02-26 |
| 10212803 | Circuit board and circuit board assembly | Tae Hong Min, Jung Han Lee, Young Gwan Ko | 2019-02-19 |