Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475751 | Fan-out semiconductor package | Seong Hee Choi, Han Kim, Hyung Joon Kim | 2019-11-12 |
| 10373884 | Fan-out semiconductor package for packaging semiconductor chip and capacitors | Han KIM, Kang Heon Hur, Young Gwan Ko | 2019-08-06 |
| 10304807 | Fan-out semiconductor package | Dae-Hyun Park, Eun Jung Jo, Sung Won Jeong, Han Kim | 2019-05-28 |
| 10217631 | Fan-out semiconductor package | Han Kim, Dae-Hyun Park, Sang Jong Lee, Seong Hee Choi | 2019-02-26 |