Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461008 | Electronic component package having stress alleviation structure | Sung Won Jeong, Ji Hoon Kim, Sun Ho Kim, Shang Hoon Seo, Seung Yeop Kook | 2019-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461008 | Electronic component package having stress alleviation structure | Sung Won Jeong, Ji Hoon Kim, Sun Ho Kim, Shang Hoon Seo, Seung Yeop Kook | 2019-10-29 |