Issued Patents 2019
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-12-31 |
| 10515925 | Die processing | — | 2019-12-24 |
| 10515913 | Multi-metal contact structure | Rajesh Katkar | 2019-12-24 |
| 10515838 | Method and apparatus for stacking devices in an integrated circuit assembly | — | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10475733 | Method and structures for heat dissipating interposers | Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2019-11-12 |
| 10475726 | Low CTE component with wire bond interconnects | Rajesh Katkar | 2019-11-12 |
| 10446532 | Systems and methods for efficient transfer of semiconductor elements | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2019-10-15 |
| 10446441 | Flat metal features for microelectronics applications | — | 2019-10-15 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2019-10-08 |
| 10418338 | Interconnections for a substrate associated with a backside reveal | — | 2019-09-17 |
| 10410977 | High performance compliant substrate | Rajesh Katkar | 2019-09-10 |
| 10396114 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Michael Newman, Terrence Caskey | 2019-08-27 |
| 10333014 | Method and substrates for making photovoltaic cells | Emeka Nchekwube | 2019-06-25 |
| 10332833 | Ultra high performance interposer | Zhuowen Sun | 2019-06-25 |
| 10332854 | Anchoring structure of fine pitch bva | Rajesh Katkar, Gabriel Z. Guevara, Xuan Li, Guilian Gao, Liang Wang | 2019-06-25 |
| 10325880 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Sangil Lee, Liang Wang, Guilian Gao | 2019-06-18 |
| 10297582 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more | 2019-05-21 |
| 10290613 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2019-05-14 |
| 10283484 | Low cost substrates | Arkalgud R. Sitaram | 2019-05-07 |
| 10283449 | Low stress vias | Ilyas Mohammed, Belgacem Haba | 2019-05-07 |
| 10269756 | Die processing | — | 2019-04-23 |
| 10211160 | Microelectronic assembly with redistribution structure formed on carrier | Belgacem Haba, Wael Zohni | 2019-02-19 |
| 10204893 | Stacked dies and methods for forming bonded structures | Arkalgud R. Sitaram, Paul M. Enquist | 2019-02-12 |
| 10199275 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2019-02-05 |