Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483217 | Warpage balancing in thin packages | Belgacem Haba, Craig Mitchell, Gabriel Z. Guevara, Javier A. Delacruz | 2019-11-19 |
| 10420235 | Electronic device including capacitance generating device | Sung Won Park, Seungyup Lee, Won-Jea Jang | 2019-09-17 |
| 10325880 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Liang Wang, Guilian Gao | 2019-06-18 |
| 10304803 | Nanoscale interconnect array for stacked dies | Liang Wang, Bongsub Lee, Belgacem Haba | 2019-05-28 |
| 10177114 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Liang Wang, Guilian Gao | 2019-01-08 |