Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-12-31 |
| 10515926 | System and method for providing 3D wafer assembly with known-good-dies | Hong Shen, Liang Wang | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2019-12-17 |
| 10332854 | Anchoring structure of fine pitch bva | Rajesh Katkar, Gabriel Z. Guevara, Xuan Li, Cyprian Emeka Uzoh, Liang Wang | 2019-06-25 |
| 10325880 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Liang Wang | 2019-06-18 |
| 10256177 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Arkalgud R. Sitaram | 2019-04-09 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-01-08 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Arkalgud R. Sitaram | 2019-01-08 |
| 10177114 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Liang Wang | 2019-01-08 |