Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510659 | Substrate-less stackable package with wire-bond interconnect | — | 2019-12-17 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2019-12-17 |
| 10460958 | Method of manufacturing embedded packaging with preformed vias | Belgacem Haba | 2019-10-29 |
| 10396041 | High yield substrate assembly | Liang Wang, Masud Beroz | 2019-08-27 |
| 10354942 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2019-07-16 |
| 10297582 | BVA interposer | Terrence Caskey, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more | 2019-05-21 |
| 10290612 | Systems and methods for flash stacking | Belgacem Haba, Javier A. Delacruz | 2019-05-14 |
| 10290589 | Folding thin systems | Belgacem Haba | 2019-05-14 |
| 10283449 | Low stress vias | Belgacem Haba, Cyprian Emeka Uzoh | 2019-05-07 |
| 10262947 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2019-04-16 |
| 10199275 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Vage Oganesian | 2019-02-05 |
| 10170412 | Substrate-less stackable package with wire-bond interconnect | — | 2019-01-01 |