Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522352 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, William C. Plants, David Edward Fisch | 2019-12-31 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10446487 | Interface structures and methods for forming same | Javier A. Delacruz | 2019-10-15 |
| 10403577 | Dielets on flexible and stretchable packaging for microelectronics | Javier A. Delacruz | 2019-09-03 |
| 10299368 | Surface integrated waveguides and circuit structures therefor | Javier A. Delacruz | 2019-05-21 |
| 10276909 | Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein | Javier A. Delacruz, Belgacem Haba | 2019-04-30 |